IC Package Innovation: Choosing the right solution

Applications and Markets are drving the need for ever increasing Package Technology innovations. There has never been so much choice in Package Technology options however companies require to choose the righ solution with an understanding of how to make it work for them based on several key criteria such as:

- Understanding the Package Technology options

- Cost drivers / options

- Thermal considerations / Reliability

This IC Pacakge Network event looks at the Emerging technologies including what you need to know in making the right choices in topics such as such as Copper Bonding technology/ 3D Technology/Thermal Modelling.