Social Networking for the Microelectronics Industry
Three-dimensional architectures such as chip stacks provide both good and bad news for power-oriented design. At the recent 3D Architectures conference near San Francisco, IBM's Subramanian Iyer could see clear benefits in moving to stacks that make use of through-silicon visa to expand capacity.
IBM already makes use of embedded DRAM to increase the amount of available memory in the third- and fourth-level caches that its mainframes and supercomputers employ. His question…
ContinueAdded by Low Power Design Blog on December 17, 2010 at 14:16 — No Comments
Added by Low Power Design Blog on September 7, 2010 at 12:22 — No Comments
Is parallel-mode double datarate memory hitting the buffers in terms of power consumption at the high end? And, if so, is there anything to replace it? That’s the question panelists sought to answer at the Memcon event in Santa Clara, California late last month.…
ContinueAdded by Low Power Design Blog on August 10, 2010 at 9:22 — No Comments
Kingston Technology has demonstrated what happens when power consumption begins to spiral out of control. The company has launched heatspreaders for memory modules that are fitted with pipes for water cooling for those people who like to have the fastest possible PC for gaming.…
ContinueAdded by Low Power Design Blog on August 3, 2010 at 15:29 — No Comments
In taking a look at benchmarks run on Tom’s Hardware, Steve Leibson on the Denali Memory Blog reckons DDR3 could be more important for embedded applications than for PCs.…
ContinueAdded by Low Power Design Blog on July 20, 2010 at 9:17 — No Comments
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