Astride the Packaging Roadmap - TWI/NMI

Based on our experience covering both the chip- and system-level, we will be presenting at the next TWI/NMI event on Packaging. The theme will be "Influence of Package Choice on your System Reliability". In order to reduce product costs, companies nowadays try to use off-the-shelf components. However, special care should be taken to ensure that these choices do not impact the reliability of the system. To help alleviate this risk, we have developed a 4-axis method (Performance qualification, Robustness, Reliability, Process control) to assess and solve the risk linked to inadequate choices between technologies and operating life stresses. Some of these practices could be clearly linked to methods developed by the automotive (Production Part Approval Process, qualification plan…) or aerospace (robustness, burn-in) industry. This presentation will detail the overall approach and will conclude with real-life examples based on the relationship between package and system.
If you want to discuss this, or how to work with Serma Technologies, feel free to come to our table to chat with me and Bernard Renou (Process Optimisation Expert).